Methods, systems, and devices for digitally-beamformed antennas are described. For example, an antenna assembly in accordance with the described techniques may include components that are coupled (e.g., bonded, adhered, soldered, fused) with one another, with respective components including different portions of circuitry that support digitally-beamformed signaling. A first component may include antenna elements on a first side of a substrate. A second component (e.g., including analog amplification circuitry coupled with the antenna elements) may be bonded over a first location of a second side of the first component, and a third component (e.g., including analog-to-digital and/or digital-to-analog circuitry coupled with the amplification circuitry) may be bonded over a second location of the second side of the first component. The second and third components may implement different types of semiconductor substrates and/or shielding that is tailored to the respective types of circuitry and/or radiation sensitivity or exposure of the respective components.
- 출원번호 : US2025/046280
- 출원인 : VIASAT, INC.
- 특허번호 :
- IPC : H01Q-001/22(2006.01);H01Q-003/26(2006.01);H01Q-021/00(2006.01);H01Q-021/06(2006.01);