An apparatus for measuring properties of an object comprises: an illumination system; a detector; and a processor. The illumination system is configured to emit pulsed radiation and direct the pulsed radiation to a beam spot region. The pulses of the pulsed radiation are chirped such that a wavelength of each pulse varies with temporal position in the pulse. There may be a fixed relationship between the phase of each wavelength component from different pulses (for example the pulses are formed by a mode-locked laser). The detector is arranged to receive a scattered portion of the pulsed radiation scattered from an object disposed in the beam spot region. The processor is operable to determine at least one beat frequency of radiation received by the detector and to determine one or more properties of the object (e.g. a thickness of a layer of the object) from said at least one beat frequency.

• 출원번호 : EP2025/074278
• 출원인 : ASML NETHERLANDS B.V.
• 특허번호 :
• IPC : G01B-009/02003(2022.01);G01B-009/02004(2022.01);G01B-011/24(2006.01);G03F-009/00(2006.01);

A camera module 1 comprises: a lens assembly 2; an image sensor 3 that is located on the image formation side of the lens assembly 2 in the optical axis direction and receives light coming in from the lens assembly 2; a first substrate 41 that is located on the image formation side of the image sensor 3 in the optical axis direction and has the image sensor 3 mounted on the front surface thereof; a second substrate 42 that has a processing circuit 420 for processing an output signal of the image sensor 3; a flexible wiring part 43 having flexibility and electrically connecting the first substrate 41 to the second substrate 42; a heat sink 5 mounted on the image formation side of the first substrate 41 in the optical axis direction; and a cover 6 that includes a lower cover 61 connected to the heat sink 5 and serving as a heat radiation part for radiating image sensor 3 heat transmitted through the heat sink 5, and that houses the image sensor 3, the first substrate 41, a second substrate 42, the flexible wiring part 43, and the heat sink 5.

• 출원번호 : JP2025/029862
• 출원인 : MITSUMI ELECTRIC CO., LTD.;TAKAHASHI, Daisuke;ITO, Yuta;ENDO, Shuji;ITAGAKI, Yutaka;KATO, Masaki;ISHIKAWA, Masahiro;
• 특허번호 :
• IPC : G03B-017/55(2021.01);G03B-017/02(2021.01);G03B-030/00(2021.01);H04N-023/52(2023.01);

An apparatus and a method for separating a shielding ball are disclosed. An apparatus for separating a shielding ball comprises: an end shield which is installed in a spinning structure of a heavy water reactor facility and includes a fueling tubesheet and a calandria tubesheet facing each other and multiple shielding balls for filling a space between the calandria tubesheet and the fueling tubesheet; as a device for removing the shielding balls from a lattice tube connected to the calandria tube by being connected to the calandria tubesheet through the fueling tubesheet, a magnetic force applying unit inserted into the lattice tube in a direction of the fueling tubesheet to apply a magnetic force for fixing positions of the multiple shielding balls positioned within a first distance from the calandria tubesheet; a mover for moving the magnetic force applying unit in a direction of the lattice tube; and a storage rack for separately storing, inside the end shield, the shielding balls positioned within the first distance from the calandria tubesheet and shielding balls positioned at a distance greater than the first distance.

• 출원번호 : KR2025/013018
• 출원인 : KOREA HYDRO &NUCLEAR POWER CO., LTD.;KOREA PLANT SERVICE &ENGINEERING CO., LTD.;DOOSAN ENERBILITY CO., LTD.;
• 특허번호 :
• IPC : G21C-019/20(2006.01);H01F-007/20(2006.01);G21C-001/14(2006.01);

The present disclosure relates to improvements to UV sensing. In one example there is provided a UV sensing system comprising: a UV photodiode which provides a UV signal responsive to excitation by incident radiation wavelengths within a predetermined in- band range of wavelengths, the provided signal being modified by a) changes in temperature of the UV photodiode; and b) the presence of one or more out-of-band wavelengths in the incident radiation, wherein the excitations due to out-of-band wavelengths are not additive, thereby evading identification by traditional monochromatic characterisation techniques as contributing to the spectral response of the UV photodiode; wherein the UV sensing system is configured to mitigate and/or compensate for the modification of the UV signal.

• 출원번호 : IB2025/058551
• 출원인 : SCIENTERRA LIMITED
• 특허번호 :
• IPC : G01J-001/42(2006.01);G01J-001/02(2006.01);G01J-001/10(2006.01);G01J-001/20(2006.01);

A glass sheet including: a silica glass composition comprising Eu ion and/or Ce ions. The glass sheet exhibits, at a thickness of 0.7 mm, (i) less than 50% transmission throughout an entirety of a wavelength range of from 200 nm to 360 nm, (ii) less than 20% transmission throughout an entirety of a wavelength range of from 250 nm to 340 nm, (iii) greater than 80% transmission throughout an entirety of a wavelength range of from 410 nm to 1200 nm, and (iv) a photoluminescence quantum yield of greater than 50% when excited with electromagnetic radiation having a wavelength within a range of from 280 nm to 370 nm. A solar panel including (a) one or more photovoltaic cells; and (b) the glass sheet as a cover over the one or more photovoltaic cells.

• 출원번호 : US2025/043479
• 출원인 : CORNING INCORPORATED
• 특허번호 :
• IPC : C03C-003/06(2006.01);C03C-003/095(2006.01);C03C-003/11(2006.01);C03C-003/112(2006.01);C03C-003/118(2006.01);C03C-004/12(2006.01);

A thermal management mechanism for heat evacuation is described. The thermal management mechanism includes a cooling jacket assembly 28 coupled to a heat source. The cooling jacket assembly 28 includes a cooling jacket core 30 which has multiple flow channels 32 and surrounds a sleeve 34. The cooling jacket assembly 28 evacuates heat from the heat source. A radiation shield 48 is connected to the heat source and evacuates radiative heat generated by the heat source. A method of evacuating heat from the heat source is also described.

• 출원번호 : IB2025/058606
• 출원인 : INDIAN INSTITUTE OF SCIENCE;TRIVENI TURBINE LIMITED;
• 특허번호 :
• IPC : F01D-025/12(2006.01)

A radiation shielding material for use in spacecraft comprises boron carbide particles dispersed in an epoxy matrix. In one aspect, the material is formed into modular panels attachable to satellite structures for attenuation of neutron and charged particle radiation. In another aspect, the boron carbide epoxy mixture is applied as a conformal coating to satellite components and cured in place to provide localized shielding. The composite may also be used to pot electronic components within a protective volume. The method of fabrication includes mixing boron carbide with epoxy resin and hardener, stirring until homogeneous, and curing the mixture to form a solid shielding structure. The system provides effective radiation mitigation with reduced weight and form factor compared to traditional metal or high-density polymer shields, and is compatible with aerospace integration and environmental requirements.

• 출원번호 : US2025/043505
• 출원인 : ACME ATRONOMATIC, LLC
• 특허번호 :
• IPC : G21F-001/10(2006.01);B64G-001/22(2006.01);B64G-001/54(2006.01);

Disclosed herein are statistical methods that use randomized sampling to generate a precise dose volume histogram (DVH) without the computational intensity of subdivision methods that rely on super-sampling of a 3D dose image. One variation of a method rapidly generates a DVH from a dose image by generating a randomly spaced point cloud of arbitrary size for each voxel of a volume of interest (VOI). These methods may be used to help expedite radiotherapy treatment planning and/or facilitate clinician review of whether a radiation dose distribution is acceptable. These methods may also be used to facilitate the calculation of bounded DVH curves. In some variations, adaptive radiotherapy methods may use these rapidly-generated DVHs to update or adjust radiation delivery on the day of treatment.

• 출원번호 : 19310779
• 출원인 : MIRONENKO, Foma
• 특허번호 :
• IPC : G06T-011/20(2026.01);A61N-005/10(2006.01);G16H-030/20(2018.01);

An electronic device includes a frame body and a processing chip. A target member of the frame body is made of metal and used as a frame antenna. The frame antenna is at least capable of transmitting and receiving radiation signals of a target frequency band. A radiation space of the radiation signals transmitted by the frame antenna at least includes a first radiation space located on one side of a first surface of the frame body and a second radiation space located on one side of a second surface of the frame body. The first surface and the second surface are non-intersecting. The target member connects the first surface and the second surface. The processing chip is configured to determine a distance between the target device and the electronic device based on the radiation signals transmitted by the target device received by the frame antenna.

• 출원번호 : 19310182
• 출원인 : CHEN, Kangkang
• 특허번호 :
• IPC : H01Q-001/22(2006.01);G01S-013/42(2006.01);G06F-001/16(2006.01);H01Q-001/36(2006.01);H01Q-001/44(2006.01);

Non-viral gene therapy treatments have a number of advantages over viral vectors including typical non-antigenicity, low manufacturing cost, simplicity, and efficiency of delivering genetic cargo into the cytoplasm. The potency of non-viral gene therapy systems can be enhanced by providing them with means to more efficiently transport the delivered DNA from the cytoplasm to the nucleus. Provided herein, at least in part, are means of enhancing potency of non-viral gene therapies by including novel nuclear translocation enhancing sequences and compositions that can result in optimized nuclear translocation as well as related compositions and methods.

• 출원번호 : US2025/043326
• 출원인 : REMEDIUM BIO, INC.;HOLLANDER, Judith;ALTUG, Yasemin;GORALTCHOUK, Alex;LUPPINO, Frank;SEREGIN, Alexey;
• 특허번호 :
• IPC : A61K-009/127(2025.01);A61K-009/51(2006.01);A61K-031/713(2006.01);A61K-048/00(2006.01);C12N-015/85(2006.01);C12Q-001/6809(2018.01);G01N-033/574(2006.01);A61P-021/00(2006.01);A61P-003/00(2006.01);A61P-031/00(2006.01);A61P-009/00(2006.01);