The present invention provides: a radiation-sensitive composition which is capable of exhibiting sensitivity, CDU, overexposure CDU, and underexposure CDU at levels equal to or higher than conventional levels when forming a pattern; and a pattern forming method. This radiation-sensitive composition contains a first polymer and a solvent, wherein the first polymer comprises a structural unit (I) that has an acid dissociable group, a structural unit (II) that has an organic acid anion and an onium cation and comprises an acid-generating structure which generates an acid upon exposure to light, and a partial structure (a) that is represented by formula (a). (In formula (a), Z represents a hydrogen atom, a halogen atom, a nitro group, or a monovalent organic group having 1-20 carbon atoms, and * is an atomic bond with another structure of the polymer.)
- 출원번호 : JP2025/031497
- 출원인 : JSR CORPORATION
- 특허번호 :
- IPC : G03F-007/039(2006.01);C08F-212/14(2006.01);C08F-220/16(2006.01);G03F-007/004(2006.01);G03F-007/20(2006.01);